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ElectroFlo x64

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company name:
TES International
license: Demo
minimum requirements:
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ElectroFlo x64 description


ElectroFlo x64 is an electronics cooling package designed for high power density applications. It is a fully featured and efficient thermal analysis software that combines the power of coupled thermal/electrical analysis with the ease-of-use of an object oriented Graphical User Interface to provide solutions to challenging problems facing today's electronics analysts and designers. The software can be used for the component level, pcb analysis, and all the way up to the system level. ElectroFlo Features: Graphical User Interface On-Line Help (Topical and Context Sensitive) Transient/Steady-State Solutions Multi System Modeling Conduction, Convection, Radiation, Conjugate Heat Transfer Geometry Import (STEP, IDF, STL...) Full Computational Fluid Dynamics (CFD) (Solve for Flow and Pressure In Addition to Temperature) and Non-Computational Fluid Dynamics (CFD) (No Flow Calculations) Solution Methods Automatic Calculation and Application of Radiative Viewfactors Patented 1 Button Click Application of Radiation For Entire Model Full User Control Over Complexity of Radiosity Network Generated Fully Automatic Meshing Laminar/Turbulent Flows User Extensible Material Properties Library User Extensible Component Library User Extensible Convection Correlation Library for non-Computational Fluid Dynamics (CFD) solutions Object Based Modeling (Component, Boards, Walls and Enclosures) Open and Porous Boundaries Advanced Post Processing Features: Combined Vector-Temperature Fringe Plots Bar Chart Generation Showing Selected Component Temperatures Extensive Automatic Report Generation Average Temperature Calculation Over User Specified Region X-Y Plotting Nonlinear Boundary Conditions Spatial, Time and / or Temperature Dependent Tabular or Functional Specification Periodic Boundary Conditions Coupled Thermal/Electrical Analysis Solve for Temperature, Flow and Voltage Fields using Electrical Current and Voltage Boundary Conditions Heat Exchanger/Fluid Network Boundary Condition Point-to-Point Thermal/Electrical Links Provide Additional Heat/Current Path by Specifying Resistance. Ideal For Modeling Leads and Cables. Extensive List of Tools



Relates:
Simulation - Structural Analysis - Thermal Analysis - X64 Analysis - X64 Analyze - Electronics Cooling - Electronics Cooling Software - Thermal Management - Thermal Management Software - Thermal Analysis Software - Electroflo - Heat Transfer - Thermal Electrical - X64 Thermal Analysis - X64 Analyze Electronic Component - X64 Pcb Analysis - X64 Thermal
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ElectroFlo x64
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supported os's
Windows
    WinXP
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downloads 26
version 4.6.13.0
size in Kb 116,736
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